Location: Sunnyvale-Remote
Responsibilities:
Design of semiconductor packages and modules for AR/VR Silicon.
Design feasibility studies based on electrical performance and form factor requirements.
Support electrical extraction and SI/PI/PDN analysis on the package design.
Ideation of new architecture/ design concepts such as Client interfaces for Sensor-Compute etc
Skills:
Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
Familiarity with image sensors and camera modules would be a plus
7-10 years' of experience in hands-on Package/Module/PCB design
BS/MS/equivalent experience in engineering; PhD preferred
Tools to know:
Cadence (APD/PCB Designer/OrCAD)
Mentor (Hyperlynx/Expidition)
HFSS
ANSYS
Signal Integrity
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.
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Responsibilities:
Design of semiconductor packages and modules for AR/VR Silicon.
Design feasibility studies based on electrical performance and form factor requirements.
Support electrical extraction and SI/PI/PDN analysis on the package design.
Ideation of new architecture/ design concepts such as Client interfaces for Sensor-Compute etc
Skills:
Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
Familiarity with image sensors and camera modules would be a plus
7-10 years' of experience in hands-on Package/Module/PCB design
BS/MS/equivalent experience in engineering; PhD preferred
Tools to know:
Cadence (APD/PCB Designer/OrCAD)
Mentor (Hyperlynx/Expidition)
HFSS
ANSYS
Signal Integrity
Nesco Resource offers a comprehensive benefits package for our associates, which includes a MEC (Minimum Essential Coverage) plan that encompasses Medical, Vision, Dental, 401K, and EAP (Employee Assistance Program) services.
Nesco Resource provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state, or local laws.